These specifications position the Supermicro NVIDIA HGX B200 as a robust solution for large-scale AI and high-performance computing applications, offering substantial GPU resources, extensive memory capacity, and flexible expansion options.
Supermicro ramps full production of NVIDIA Blackwell Rack-Scale Solutions, offering next-gen air-cooled and liquid-cooled architecture for NVIDIA Blackwell Platform - and they are available now!
The new air-cooled 10U NVIDIA HGX B200 system features a redesigned chassis with expanded thermal headroom to accommodate eight 1000W TDP Blackwell GPUs. Up to 4 of the new 10U air-cooled systems can be installed and fully integrated in a rack, the same density as the previous generation, while providing up to 15x inference and 3x training performance.
"In this transformative moment of AI, where scaling laws are pushing the limits of data centre capabilities, our latest NVIDIA Blackwell-powered solutions, developed through close collaboration with NVIDIA, deliver outstanding computational power," said Charles Liang, president and CEO of Supermicro.
"Supermicro's NVIDIA Blackwell GPU offerings in plug-and-play scalable units with advanced liquid cooling and air cooling are empowering customers to deploy an infrastructure that supports increasingly complex AI workloads while maintaining exceptional efficiency. This reinforces our commitment to providing sustainable, cutting-edge solutions that accelerate AI innovation."
Technical specs
The Supermicro NVIDIA HGX B200 is a high-performance server system designed for demanding AI workloads, including training, fine-tuning, and inference. Key technical specifications include:
Processor Support:
- Dual Intel® Xeon® 6900 series processors with P-cores, supporting up to 128 cores and 256 threads per CPU.
GPU Configuration:
- 8x NVIDIA HGX B200 GPUs, each equipped with 180GB of HBM3e memory, interconnected via NVIDIA NVLink with NVSwitch™, providing a total of 1.4TB GPU memory per system.
Memory Capacity:
- 24 DIMM slots supporting ECC RDIMM or MRDIMM DDR5 memory, with speeds up to 8800MT/s (1DPC), allowing for a maximum system memory of up to 6TB.
Expansion Slots:
- 10 PCIe 5.0 x16 low-profile (LP) slots and 2 PCIe 5.0 x16 full-height, half-length (FHHL) slots for additional expansion cards.
Storage Options:
- 10 front hot-swap 2.5" PCIe 5.0 x4 NVMe drive bays, plus 2 M.2 PCIe 4.0 x4 NVMe slots (M-key 2280/22110/25110) for flexible storage configurations.
Networking Capabilities:
- 2x RJ45 10GbE ports (Intel® X710) for network connectivity.
Power Supply:
- Six 5250W redundant power supplies (3+3 configuration) to ensure reliable operation.
Cooling System:
- Equipped with 15 counter-rotating 80x80x80mm fans and 4 counter-rotating 60x60x56mm fans to maintain optimal temperatures.
Form Factor and Dimensions:
- 10U rackmount chassis with dimensions of 17.2" (H) x 17.6" (W) x 33.2" (D).
